Preview

Journal of Instrument Engineering

Advanced search
Open Access Open Access  Restricted Access Subscription Access

Analytical Method for Calculating the Thickness of Protective Mask Layers in the Manufacturing of a Micromechanical Accelerometer

https://doi.org/10.17586/0021-3454-2025-68-8-738-748

Abstract

Methods for determining the thickness of mask layers for plasma chemical etching processes are considered. A method for calculating the thickness of the mask layers during the formation of an instrument layer for the manufacture of sensitive elements of a micromechanical accelerometer is proposed. The results of the evaluation of the calculation method based on the measured values of the mask thickness before and after plasma-chemical etching of the instrument layer on a silicon substrate with sensitive elements are presented. A conclusion is formulated on the effectiveness of using the presented method in the manufacturing technology of micromechanical accelerometers and gyroscopes.

About the Author

N. S. Karanin
ITMO University
Russian Federation

Nikita S. Karanin — Post-Graduate Student, Faculty of Control Systems and Robotics

St. Petersburg



References

1. Kalinkina M.E., Pirozhnikova O.I., Tkalich V.L., Komarova A.V. Mikroelektromekhanicheskiye sistemy i datchiki (Microelectromechanical systems and sensors), St. Petersburg, 2020. (in Russ.)

2. Ramalingam R., Ganesan A., Shanmugam J. Defence Science Journal, 2009, рр. 650–658.

3. Liu Y., Chen L. 5th International Conference on Electric Utility Deregulation and Restructuring and Power Technologies (DRPT), 2015, рр. 1488–1491.

4. Popova I., Lestev A., Semenov A., Ivanov V., Rakityanski O., Burtsev V. IEEE Aerospace and Electronic Systems Magazine, 2009, no. 5(24), pp. 33–39.

5. Kalinkina M.E., Kozlov A.S., Labkovskaya R.Ya., Pirozhnikova O.I., Tkalich V.L. Journal of Instrument Engineering, 2019, no. 6(62), pp. 534–541. (in Russ.)

6. Gurtov V.A., Belyaev M.A., Baksheeva A.G. Mikroelektromekhanicheskiye sistemy (Microelectromechanical systems), Petrozavodsk, 2016. (in Russ.)

7. Vasiliev V.Yu. Sovremennoye proizvodstvo izdeliy mikroelektroniki (Modern Production of Microelectronics Products), Novosibirsk, 2019. (in Russ.)

8. Timoshenkov S.P., Anchutin S.A., Zarjankin N.M., Kalugin V.V., Kochurina E.S., Timoshenkov A.S., Boev L.R. Nano- and Microsystems Technology, 2021, no. 2, pp. 63–67. (in Russ.)

9. Lips B., Puers R. Journal of Physics: Conference Series, 2016, vol. 757.

10. Horstmann B., Pate D., Smith B., Mamun Md A., Atkinson G., Özgür Ü., Avrutin V. Journal of Micromechanics and Microengineering, 2024, no. 7(34), pp. 1–13.

11. Bobinac J., Reiter T., Piso J., Klemenschits X., Baumgartner O., Stanojevic Z., Strof G., Karner M., Filipovic L. Micromachines, 2023, no. 3(14), pp. 665, DOI:10.3390/mi14030665.

12. Yoon M., Yeom H.J., Kim J., Jeong J-R., Lee H-Ch. Applied Surface Science, 2022, no. 1(595), pp. 153462, DOI:10.1016/j.apsusc.2022.153462.

13. Racka-Szmidt K., Stonio B., Żelazko J., Filipiak M., Sochacki M. Materials (Basel), 2021, no. 1(15), pp. 123.

14. Osipov A.A., Iankevich G.A., Speshilova A.B. et al. Scientific Reports, 2022, no. 1(12), pp. 5287, DOI:10.1038/s41598-022-09266-x.

15. Bagolini A., Scauso P. & Sanguinetti S., Bellutti P. Materials Research Express, 2019, no. 8(6).

16. Vinogradov A.I., Zaryankin N.M., Prokopyev E.P., Timoshenkov S.P. News of universities. Electronics, 2010, no. 2(82), pp. 3–9. (in Russ.)

17. Karanin N.S. Nano- and Microsystems Technology, 2024, no. 4(26), pp. 198–204. (in Russ.)

18. Karanin N., Yulmetova O. 30th Saint Petersburg International Conference on Integrated Navigation Systems, ICINS 2023, 2023, рр. 1–3.

19. Hu X., Zhen Zh., Sun G., Wang Q., Huang Q. Journal of Micromechanics and Microengineering, 2022, no. 4(32), DOI:10.1088/1361-6439/ac56c9.

20. Xia D., Yu C., Kong L. Sensors, 2014, vol. 14, рр. 1394–1473.

21. Greiff P., Boxenhorn B., King T., Niles L. TRANSDUCERS ‘91: 1991 International Conference on Solid-State Sensors and Actuators, Digest of Technical Papers, 1991, рр. 966–968.

22. Ayanoor-Vitikkate V., Chen K., Park W.-T., Kenny Th.W. Sensors and Actuators A: Physical, 2009, no. 2(156), pp. 275–283.


Review

For citations:


Karanin N.S. Analytical Method for Calculating the Thickness of Protective Mask Layers in the Manufacturing of a Micromechanical Accelerometer. Journal of Instrument Engineering. 2025;68(8):738-748. (In Russ.) https://doi.org/10.17586/0021-3454-2025-68-8-738-748

Views: 63


ISSN 0021-3454 (Print)
ISSN 2500-0381 (Online)