Application of the Direct Exposure Unit Based on LS-Matrix for Compensation of Printed Circuit Boards Deformation
https://doi.org/10.17586/0021-3454-2024-67-7-622-632
Abstract
The possibility of using a laboratory prototype of a direct exposure setup using a liquid crystal (LC) matrix to form a topology on a photosensitive material to compensate for printed circuit board (PCB) deformation during their production is investigated. Existing methods for assessing PCB deformation are considered — a method for compensating for deformation at the exposure stage based on the method of controlling the compatibility of topological layers is proposed. Assumptions simplifying its implementation are defined for the proposed method. The hardware upgrade of the laboratory prototype of the setup was performed by adding a feedback loop in the form of a video camera providing information on the PCB position on the working field. Elements of preparing the setup for operation are defined. An algorithm for generating images for display on the LCD matrix is developed and tested.
Keywords
PCB manufacturing,
PCB deformation,
direct exposure,
digital photomask,
reliability of PCB manufacturing processes
Supporting agencies: the work was supported by the Russian Science Foundation, grant No. 23-29-10204.
About the Author
M. A. Korobkov
Moscow Aviation Institute
Russian Federation
Russian Federation
Maksim A. Korobkov — Post-Graduate Student; Department of Digital Technologies and Information Systems; Senior Lecturer
Moscow
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Review
For citations:
Korobkov M.A. Application of the Direct Exposure Unit Based on LS-Matrix for Compensation of Printed Circuit Boards Deformation. Journal of Instrument Engineering. 2024;67(7):622-632. (In Russ.) https://doi.org/10.17586/0021-3454-2024-67-7-622-632
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